Sriganesh Chandrasekaran’s career is a compelling story of technical mastery, perseverance, and a singular focus on advancing the state of artificial intelligence hardware. Using an impressive professional experience and academic credentials achieving his current role as a R&D Staff IC Design Engineer at Broadcom, Chandrasekaran’s journey is defined by a relentless pursuit of excellence in AI accelerator chip design—a field that sits at the heart of modern technological progress.

Chandrasekaran’s academic path began with a Bachelor of Engineering in Electrical and Electronics from Anna University, followed by a Master’s in Electrical Engineering at the University of Texas at Dallas. These formative years were marked by a deep dive into microelectronics, where he developed the technical foundation and work ethic that would drive his future achievements. A pivotal internship at Tezzaron Semiconductor gave him early exposure to both hands-on chip design and strategic business decision-making, nurturing his passion for semiconductors and providing critical experience in advanced design and verification.

Upon joining LSI Corporation (now Broadcom), Chandrasekaran quickly established himself as a rising talent in the ASIC Product Division. Over more than a decade, he progressed from a junior engineer to a leadership role, spearheading high-impact projects that have shaped the landscape of AI hardware. His work has consistently focused on the design and integration of AI inference and training accelerator chips—specialized processors that are essential for the rapid scaling and efficiency of AI-driven applications.

Chandrasekaran’s commitment to power optimization is further underscored by his published U.S. patent application (US20250038647A1) in scalable switched capacitor voltage regulators. This technology tackles one of the most pressing challenges in AI chip design: achieving peak computational performance while minimizing energy consumption. The publication of this application reflects formal recognition of the invention’s originality and relevance, positioning it as a valuable advancement for the future of energy-efficient AI hardware. Chandrasekaran’s impact is also reflected in Broadcom’s trajectory. The company’s technological leadership is inseparable from the achievements of its top engineers, and the AI accelerators and advanced packaging solutions he has developed are central to Broadcom’s role as a global leader in semiconductor innovation. By enhancing power efficiency without sacrificing speed or memory performance, his work has enabled the next generation of energy-efficient AI chips, ensuring that high-performance computing can scale sustainably as demand grows.

Recognition of Chandrasekaran’s impact extends beyond technical circles. In 2024, he was named to the DesignCon 40 Under 40, a testament to his groundbreaking achievements in low-power, high-efficiency AI accelerator chips and interposer technology. This honor reflects not only his technical contributions but also his role as a leader and innovator in the field. Among his most significant technical milestones is his leadership in the development of the world’s first 3.5D XD-SiP technology — He has contributed to the advancement of Broadcom’s 3.5D XD-SiP platform, a cutting-edge multi-die packaging technology that integrates high-performance ASICs with memory at scale with significant power reduction. This advancement has set new industry benchmarks and strengthened U.S. leadership in AI and semiconductor innovation.

The societal impact of Chandrasekaran’s work is profound. The AI accelerators he has designed are foundational to advances in cloud computing, machine learning, and data-driven decision-making—technologies that underpin critical sectors such as healthcare, finance, and autonomous systems. By enabling higher processing speeds, greater scalability, and improved energy efficiency, his contributions have empowered U.S. companies to remain at the forefront of global innovation and technological leadership.

Sriganesh Chandrasekaran’s enduring legacy in AI accelerator chip design is characterized by technical mastery, innovative vision, and a deep commitment to advancing the frontiers of semiconductor technology. His leadership in developing cutting-edge AI accelerators, pioneering work in advanced interposer integration, and dedication to power optimization have all contributed to strengthening the foundation of AI-driven innovation. Through his ongoing efforts, Chandrasekaran continues to shape the technological landscape, ensuring that the next generation of AI systems is more powerful, efficient, and accessible than ever before.

Author: James