Live
- NASA Tracks Five Giant Asteroids on Close Approach to Earth Today
- Pushpa 2 Hits ₹1000 Crore in 6 Days: How It Compares to Other Top Indian Films
- Vivo X200 and X200 Pro Launched in India: Price, Specifications, and Features
- Nitin Gadkari Admits Feeling Embarrassed at Global Summits Over Rising Road Accidents in India
- Comprehensive Review on Indiramma Housing Survey and Welfare Initiatives Conducted via Video Conference
- Jogulamba Temple Records Rs 1.06 Crore Hundi Revenue in 150 Days
- Opposition Slams ‘One Nation, One Election’ Bill as Anti-Democratic; BJP Allies Support the Move
- Celebrate Karthigai Maha Deepam Virtually with Sri Mandir’s LIVE Darshan Experience
- BJP Extends Support to Samagra Shiksha Abhiyan Employees' Strike, Demands Immediate Regularization and Welfare Benefits
- Dr. M. Priyanka Stresses Quality Education, Nutritious Meals, and Cleanliness in Schools
Transformative Collaboration: ASIP and IIT Hyderabad Forge Path for IC Packaging & Testing Education and Innovation
LtoR-Song Dong Lee, CEO, APACT, Venkata Simhadri, CEO ASIP,Dr. VK Saraswat, Dr..Mudhrika Khandelwal, Dean,Pallam Raju, Founder Partner, ASIP, Dr.Siva Vanjari, Prof, IIT Hyderabad
ASIP and IIT Hyderabad signed an MoU in the presence of Dr. V.K. SaraswatMember NITI AAYOG, Govt of India, to Jointly do R&D to develop next generation packages and skilled work-force for the OSAT industry
Hyderabad, India: Hyderabad based ASIP Technologies, a semiconductor startup and IIT Hyderabad are joining forces to establish fundamental training programs in IC Packaging & Testing tailored for graduates from IT, Polytechnic, and Engineering backgrounds across various workforce levels.
Venkat Simhadri, CEO, ASIP Technologies said, ASIP will grant access to their factories for invaluable hands-on training experiences for students. Additionally, both institutions will collaboratively develop advanced packaging courses at the Bachelor's and Master's levels.
Furthermore, a partnership between IIT-H faculty and students and ASIP will drive research and development efforts, including prototyping, characterization, and productization for Advanced Package designs.
Together, they will spearhead initiatives to innovate and assess new package materials and technologies.
To nurture talent, an internship program will be established, offering bachelor's and master's students the opportunity for extended internships in areas of mutual interest.
Lastly, an academic exchange program will foster collaboration, enriching the academic ecosystem and paving the way for translational research endeavors, he added.
LtoR-Mr. Venkata Simhadri, Dr. Saraswat, Dr..Mudhrika Khandelwal, Dean IIT
